點(diǎn)膠機(jī)的點(diǎn)膠技術(shù)的簡(jiǎn)單化！
點(diǎn)膠機(jī)這種點(diǎn)膠技術(shù)設(shè)備簡(jiǎn)單，只需采用脈動(dòng)的空氣壓力和針管就能實(shí)現(xiàn)點(diǎn)。它適用于中等粘度的膠體，成本低，操作、維護(hù)方便。
Dispensing machine this dispensing technology equipment is simple, only using pulsating air pressure and needle tube can achieve point. It is suitable for medium viscosity colloid with low cost and convenient operation and maintenance.
在半導(dǎo)體封裝設(shè)備中，70%以上的點(diǎn)膠機(jī)采用這種技術(shù)。但是，它也存在不足之處。在點(diǎn)膠過程中，壓縮空氣反復(fù)壓縮膠體，會(huì)使其產(chǎn)生熱量，從而影響膠體的粘度；隨著針筒內(nèi)剩余的膠體越來越少，針筒內(nèi)氣體的體積越來越大，將這些氣體壓縮到一定壓強(qiáng)就需要更多的時(shí)間。在高速點(diǎn)膠時(shí)，對(duì)這些因素的控制更是困難。
In semiconductor packaging equipment, more than 70% of dispensers use this technology. However, it also has shortcomings. In the dispensing process, the compressed air repeatedly compresses the colloid, which will generate heat, thus affecting the viscosity of the colloid; as the remaining colloid in the syringe is less and less, the volume of the gas in the syringe is larger and larger, it will take more time to compress these gases to a certain pressure. When dispensing at high speed, it is more difficult to control these factors.
點(diǎn)膠機(jī)在定量點(diǎn)膠過程中，更基本的要求是在整個(gè)點(diǎn)膠過程中保持膠體流速和點(diǎn)膠效果一致。膠的有效使用要求摻和許多的因素，包括產(chǎn)品設(shè)計(jì)問題，來適應(yīng)充膠工藝和產(chǎn)品需要。隨著電路的密度增加和產(chǎn)品形式因素的，電子工業(yè)已出現(xiàn)許許多多的新方法，將芯片級(jí)的設(shè)計(jì)更緊密地與板級(jí)裝配結(jié)合在一起。
In the process of quantitative dispensing, the most basic requirement of dispensing machine is to keep the gel flow rate and dispensing effect consistent in the whole dispensing process. The effective use of glue requires many factors, including product design, to meet the needs of filling process and products. With the increase of circuit density and the elimination of product form factors, many new methods have emerged in the electronic industry, which combine chip level design with board level assembly more closely.
在某種程度上，諸如倒裝芯片和芯片級(jí)包裝等技術(shù)的出現(xiàn)事實(shí)上已經(jīng)模糊了半導(dǎo)體芯片、芯片包裝方法與印刷電路板裝配級(jí)工藝之間的傳統(tǒng)劃分界線。
To some extent, the emergence of technologies such as flip chip and chip level packaging has in fact blurred the traditional demarcation line between semiconductor chip, chip packaging method and PCB assembly level process.
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